- Mechatronics Engineer
- Engineer
- Packaging Engineer
- Design Engineer
- Process Engineer
- Senior Software Engineer
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- Ic Package Design Engineer
- Ic Design Engineer
- Staff Engineer
- Senior Mechanical Engineer
- Senior Manufacturing Engineer
- Qa Chemist
- Controls Automation
About GlobalFoundries: GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries
About GlobalFoundries: GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries
About Syenta Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Manufacturing (LEM) technology. Our platform enables advanced packaging by combining patterning and metallisation into a single tool. We achieve high-speed, high-resolution metallisation
About Syenta Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Manufacturing (LEM) technology. Our platform enables advanced packaging by combining patterning and metallisation into a single tool. We achieve high-speed, high-resolution metallisation
About Syenta As AI drives demand for high-bandwidth, high-density advanced packaging, the industry needs new manufacturing approaches that can scale beyond the limitations of conventional lithography-based metallisation. Syenta is building the tool, process, and engineering capability required
About Syenta Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Manufacturing (LEM) technology. Our platform enables advanced packaging by combining patterning and metallisation into a single tool. We achieve high-speed, high-resolution metallisation
About Syenta Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Manufacturing (LEM) technology. Our platform enables advanced packaging by combining patterning and metallisation into a single tool. We achieve high-speed, high-resolution metallisation
About Syenta Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Manufacturing (LEM) technology. Our platform enables advanced packaging by combining patterning and metallisation into a single tool. We achieve high-speed, high-resolution metallisation
About Syenta Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Manufacturing (LEM) technology. Our platform enables advanced packaging by combining patterning and metallisation into a single tool. We achieve high-speed, high-resolution metallisation
About Syenta Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Manufacturing (LEM) technology. Our platform enables advanced packaging by combining patterning and metallisation into a single tool. We achieve high-speed, high-resolution metallisation
Diraq is seeking a Lead Packaging Engineer to oversee the architecture and development of advanced packaging solutions for silicon-based quantum processors. The role requires collaboration with cross-disciplinary teams and the implementation of cutting-edge semiconductor packaging technologies. Located in the central
Job Overview At Diraq, we scale millions of qubits on a single chip using silicon CMOS, aiming for practical, commercial quantum applications. This global company has teams in Sydney, Australia, and Palo Alto, Boston, LA, and
Forefront RF in Australia is seeking an Assembly Engineer to drive the assembly and packaging of RF semiconductor products. This newly created role offers a unique opportunity to shape product development from prototype to volume production. You will
Staff Engineer, Software Release and Packaging - RISC V Australia; Canada; United States Tenstorrent is leading the industry on cutting‑edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm,
Contract Type: Full-time, Permanent Location: Cambridge, UK Closing date for applications: Wednesday 27th May 2026 at 5pm (UK time) Visa Sponsorship available Join Nu Quantum - Shaping the Future of Technology Nu Quantum is at the
About Syenta Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Metallization (LEM) technology. Our platform enables advanced packaging by combining patterning and metallisation into a single tool. We achieve high‑speed, high‑resolution metallisation
It’s more than a job When you work in Freight Logistics and Operations at Kuehne+Nagel, you play a key role in optimising processes and ensuring that inventory and shipments move efficiently. But that is not all.
Job Description Senior Mechatronics Engineer, Controls & Electronics Sydney | Full time | Hybrid | $110k to $150k + super + meaningful equity Relocation and visa support available for the right person The Mission What happens
Overview About Syenta Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Manufacturing (LEM) technology. Our platform enables advanced packaging by combining patterning and metallisation into a single tool. We achieve high-speed, high-resolution
About Syenta As AI drives demand for high-bandwidth, high-density advanced packaging, the industry needs new manufacturing approaches that can scale beyond the limitations of conventional lithography-based metallisation. Syenta is building the tool, process, and engineering capability required